Reflow ovens that support lead-free soldering. To run temperature profiles, we recommend to use the Beta Reflow Kit. With the aid of a freely positionable additional temperature sensor, critical areas can be monitored separately directly on the PCB. temperatures between 217 and 220C, which is 30C or more higher than conventional solders containing lead. It must be pointed out however that the oven alone is not able to run temperature profiles. Process-related odors or gases can be safely discharged to an exhaust system via an outlet opening.įour thermocouples monitor perfect heat distribution in the process chamber and separately control the infrared heating elements on the top and bottom of the chamber. Active cooling at the end of the soldering process with the chamber closed prevents uncontrolled temperature fluctuations in the material. Average Air Temperature Average Peak Puck Temperature Range Heat Transfer Coefficient (BTU/ ft2hr2) OVEN A 210C 156C54C 15.41 OVEN B 233C 185C48C 18.79 OVEN C 228C 172C56C 14.31 OVEN D 212C 159C53C 14.52 As the difference in measured values increases the coefficient of heat transfer decreases. This oven is designed to reflow lead-free solder paste with liquidus temperature around 217C (max temp around 250C). In addition to predefined process profiles, custom temperature profiles and process times can be freely set in the software. With the help of a DIY thermocouple measurement system, you can use a cheap toaster oven to accurately reproduce a reflow-soldering temperature profile. Depending on the solder used, the optimum process parameters can be stored in the integrated software. A reflow soldering profile has been developed for SnAgCu solder paste regarding mass production requirements, measurement and furnace tolerances as well as. The large viewing window in the thermally decoupled door allows visual control of the process. The compact LPKF Edition SMT ProtoFlow S4 hot air oven is the ideal device for lead-free RoHS-compliant reflow soldering.
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